Protection and Assembly of Outer Glass Surfaces of an Electronic Device Housing

ABSTRACT

Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority benefit of U.S. Provisional ApplicationNo. 61/325,801, filed Apr. 19, 2010 and entitled “HOUSINGS FORELECTRONIC DEVICES AND METHODS THEREFOR,” which is hereby incorporatedherein by reference.

This application also claims priority benefit of U.S. ProvisionalApplication No. 61/300,780, filed Feb. 2, 2010 and entitled “HANDHELDELECTRONIC DEVICES,” which is hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

Portable electronic devices can be constructed using a variety ofdifferent approaches. For example, a “bucket” type approach can be usedin which a first housing component serves as a bucket into whichelectronic device components are placed, and a second housing componentserves as a cover for the bucket. This arrangement secures theelectronic device components between the first and second housingcomponents. As a variation of this, some or all of the electronic devicecomponents can be assembled into the cover for the bucket, and the covercan subsequently be rotated into the bucket to close the device.

Other known portable electronic devices can be constructed by insertingcomponents into a hollow housing element. For example, an electronicdevice can be constructed using a tubular structure (e.g., a flattenedtube or a hollow rectangular tube) into which electronic devicecomponents can be inserted. The electronic device components can beinserted into the tubular structure from one or both ends, and connectedwithin the structure. For example, one or more circuits inserted fromopposite ends of the tubular structure can be connected through anopening for a window in the structure. The structure can be capped atone or both ends to ensure that the components remain fixed within thetubular structure, and to provide interface components (e.g.,connectors, buttons, or ports) for the device.

Unfortunately, however, as portable electronic device continue to bemade smaller, thinner and/or more powerful, there remains a continuingneed to provide improved techniques and structures for providinghousings for portable electronic devices.

SUMMARY

Embodiments are described herein in the context of a housing for anelectronic device. The housing can make use of at least one outer member(e.g., cover). The outer member can be aligned, protected and/or securedwith respect to other portions of the housing for the electronic device.The electronic device can be portable and in some cases handheld.

In one embodiment, an electronic device housing can have one or moreouter members (e.g., exposed major surfaces), such as front or backsurfaces, that are formed of glass. Protective sides can be provided insome embodiments to protect the edges of the one or more glass surfacesso as to dissipate impact forces and thus reduce damage to theelectronic device housing. The one or more glass surfaces can be part ofouter member assemblies that can be secured to other portions of theelectronic device housing.

The invention pertains to apparatus, systems and methods for assemblingelectronic devices, namely, portable or handheld electronic devices.

The invention may be implemented in numerous ways, including, but notlimited to, as a method, system, device, or apparatus. Severalembodiments of the invention are discussed below.

As an electronic device enclosure, one embodiment can, for example,include at least a front cover assembly placed and secured to provide afront surface for the electronic device enclosure. The front coverassembly can include a front cover member and a protective side member.The front cover member can have exposed edges, and the protective sidemember can be provided against and around the exposed edges of the frontcover member. In one implementation, the front cover member can beprimarily, if not exclusively, made of glass.

As an electronic device enclosure, another embodiment can, for example,include at least a front cover assembly placed and secured to provide afront surface for the electronic device enclosure. The front coverassembly can include at least a front cover member and a front interfacemember, with the front cover member being adhered to the front interfacemember. The embodiment can also include at least a back cover assemblyplaced and secured to provide a back surface for the electronic deviceenclosure. The back cover assembly can include at least a back covermember and a back interface member, with the back cover member beingadhered to the back interface member.

As an electronic device enclosure, still another embodiment can, forexample, include at least an outer periphery member defining a sidesurface for the electronic device enclosure, and an internal structuresecured to an inner surface of the outer periphery member, where theinternal structure is offset from front and back planar boundaries ofthe outer periphery member. The embodiment can also include a frontcover assembly placed and secured adjacent the front planar boundary ofthe outer peripheral boundary, thereby providing a front surface for theelectronic device enclosure. The front cover assembly can include atleast a front cover member and a protective side member, with theprotective side member being provided against and around the sides ofthe front cover member.

As an electronic device, one embodiment can, for example, include atleast a housing include at least one a glass surface, with the glasssurface having a first glass piece with first optical properties, and asecond glass piece with second optical properties. The second opticalproperties are typically different than the first optical properties.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated into and constitute apart of this specification, illustrate one or more example embodimentsand, together with the description of example embodiments, serve toexplain the principles and implementations associated with thespecification.

FIG. 1A-1D are views of an electronic device structure in accordancewith one embodiment.

FIG. 2A-2C are views of an electronic device structure in accordancewith another embodiment.

FIG. 3 is a flowchart of an illustrative process for assembling anelectronic device in accordance with one embodiment of the invention.

FIG. 4 is a flow diagram of a housing member alignment process accordingto one embodiment of the invention.

FIG. 5 is a structural diagram of an alignment configuration accordingto one embodiment.

FIG. 6 is a flow diagram of a housing member alignment process accordingto one embodiment of the invention.

FIGS. 7A-7D illustrate assembly of an assembled part according to oneembodiment.

FIG. 8A is a side view of a partial side portion of an electronic devicehousing according to one embodiment.

FIG. 8B is a side view of a partial side portion of an electronic devicehousing according to another embodiment.

FIG. 8C is a side view of a partial side portion of an electronic devicehousing according to another embodiment.

FIG. 8D is a side view of a partial side portion of an electronic devicehousing according to still another embodiment.

FIG. 9A is a cross-sectional view of an electronic device housingaccording to one embodiment.

FIG. 9B is a cross-sectional assembly diagram for the electronic devicehousing shown in FIG. 9A, according to one embodiment.

FIG. 10 is a cross-sectional view of an electronic device housingaccording to one embodiment.

FIG. 11A is a cross-sectional view of an electronic device housingaccording to one embodiment.

FIG. 11B is a cross-sectional assembly diagram for the electronic devicehousing shown in FIG. 11A, according to one embodiment.

FIG. 12 is a cross-sectional view of an electronic device housingaccording to one embodiment.

FIG. 13 is a flow diagram of an outer member assembly process accordingto one embodiment of the invention.

FIG. 14 is a side view of a partial side portion of an electronic devicehousing.

FIG. 15A is a diagrammatic perspective representation of a housing towhich a cover is assembled in accordance with one embodiment.

FIG. 15B is a diagrammatic cross-sectional side-view representation of acover assembled to housing shown in FIG. 15A.

FIG. 16 is a flow diagram for assembling of an electronic device inaccordance with one embodiment.

FIG. 17 is an assembly that includes side screws arranged to couple acover to a housing will be described in accordance with one embodiment.

FIG. 18 is a diagrammatic cross-sectional representation of a couplingthat utilizes a side screw and a slotted tab in accordance with oneembodiment.

FIG. 19 is a diagrammatic cross-sectional representation of an assemblythat includes a lobster snap and a midplate that cooperate to couple acover frame to a housing in accordance with one embodiment.

FIG. 20 is a diagrammatic representation of a housing to which amidplate is coupled in accordance with one embodiment.

FIG. 21 is a diagrammatic representation of a cover piece having aninsert molded tab and a housing having a bracket configured toaccommodate the tab in accordance with one embodiment.

FIG. 22 is a process flow diagram which illustrates a method of creatinga device that includes a cover piece having an insert molded tab and ahousing having a bracket configured to accommodate the tab in accordancewith one embodiment.

FIGS. 23A-23C illustrate perspective diagrams of a back cover assembly2300 according to one embodiment.

FIG. 24 illustrates an assembly diagram for the glass member accordingto one embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

Embodiments are described herein in the context of a housing for anelectronic device. The housing can make use of an outer member. Theouter member can be aligned, protected and/or secured with respect toother portions of the housing for the electronic device. The electronicdevice can be portable and in some cases handheld.

According to one aspect, adjoining surfaces of electronic devicehousings can be mounted or arranged such that adjoining surfaces areflush to a high degree of precision. Edges of portable electronicdevices are susceptible to impact force, such as when dropped. Accordingto another aspect, protective sides can be provided on edges ofelectronic device housings so to dissipate impact forces and thus reducedamage to electronic device housings. According to still anotherembodiment, an electronic device housing can have one or more of itsexposed major surfaces (e.g., front or back surfaces) formed of glass.The one or more glass surfaces can be protected by the protective sidesand/or can be aligned so that the top surfaces of the glass surfaces andthe protective sides can be substantially flush.

According to another aspect, apparatus, systems and methods for robustlyattaching a cover portion of an electronic device to a bottom portion,e.g., a housing portion, of the electronic device are described. Thecover portion may generally include a frame (e.g., interface member)into which n outer member (e.g., glass member) has been inserted.Attachment members (e.g., arms, tabs) can be coupled to, e.g., insertmolded into, a cover portion, and can be arranged to substantiallyengage with a housing portion such that the cover portion is effectivelyheld against the housing portion. The attachment members can be used tofasten the cover portion to the housing. In general, receptacles of thehousing portion are arranged to substantially capture, mate or otherwiseengage attachment members of the cover portion.

According to another aspect, a cover assembly can be configured tosupport and protect an outer glass member. The cover assembly can formpart of a housing for an electronic device. The cover assembly can alsoinclude a distinct glass lens, attachment members, structural support.

According to still another aspect, an optical lens can be formed from aformed optical adhesive. The optical lens can, for example, be used as alens for a camera flash of a portable electronic device. The opticallens can be provided between the camera flash and the cover member Amold can be used to form a lens from the optical adhesive.

The following detailed description is illustrative only, and is notintended to be in any way limiting. Other embodiments will readilysuggest themselves to skilled persons having the benefit of thisdisclosure. Reference will now be made in detail to implementations asillustrated in the accompanying drawings. The same reference indicatorswill generally be used throughout the drawings and the followingdetailed description to refer to the same or like parts. It should beappreciated that the drawings are generally not drawn to scale, and atleast some features of the drawings have been exaggerated for ease ofillustration.

In the interest of clarity, not all of the routine features of theimplementations described herein are shown and described. It will, ofcourse, be appreciated that in the development of any such actualimplementation, numerous implementation-specific decisions must be madein order to achieve the developer's specific goals, such as compliancewith application and business related constraints, and that thesespecific goals will vary from one implementation to another and from onedeveloper to another. Moreover, it will be appreciated that such adevelopment effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking of engineering for those ofordinary skill in the art having the benefit of this disclosure.

According to one aspect, a housing for an electronic device can includean outer periphery member that forms the sides of the electronic device.The outer periphery member can define a volume into which electronicdevice components can be placed. To obtain the components within thedevice, front and back covers can be placed over the front and backsurfaces of the outer periphery member.

An outer periphery member can provide a variety of attributes to theelectronic device including for example, structural, functional,cosmetic, or combinations of these. The outer periphery member may forexample form at least a portion of the right, left, top and bottom sidesof the device. As such, the outer periphery member may surroundcomponents that are placed in the device back to front, front to back orcenter to back and front (e.g., components inserted within the volumedefined by the outer periphery member). The outer periphery member maybe formed from one or more elements. The elements may be similar ordifferent depending on the dimensions or shape of the device, as well asfunctional or structural considerations (e.g., outer periphery memberelements serving as an antenna for tuning electromagnetic waves). Ifseveral elements are combined to form the outer periphery members, theelements can be connected in any suitable manner to form a single unithaving adequate structural, functional, or cosmetic properties. In somecases, the outer periphery member can be formed from several elementsthat act as a single integral unit (e.g., a unitary part). For example,the elements can be integrally formed together.

In some embodiments, the outer periphery member can define a band thatforms an enclosed volume having a front and back open area. The band maydefine a ring-like structure that wraps around some or all of thecomponents of the electronic device. The electronic device can include avariety of components such as housing elements, electronics, structuralmembers, or combinations of these. In some cases, one or more structuralmembers (e.g., a mid-plate) can be connected to the outer peripherymember within the volume enclosed by the outer periphery member toreceive and support components, or enhance the structural properties ofthe outer periphery member.

In some embodiments, the electronic device can include front and/or backcover assemblies operative to cap the volume defined by the outerperiphery member. The cover assemblies can be positioned relative to theopen areas of the outer periphery member such that the front and backcover assemblies are placed adjacent to the front and back surfaces ofthe outer periphery member, respectively. The cover assemblies caninclude any suitable feature, including for example housing portions,access points, electronics, structural members, aesthetic members, orcombinations of these. In some cases, the cover assemblies can includeone or more features for securing or retaining electronic devicecomponents within the volume enclosed by the outer periphery member.

The outer periphery member and the front and back cover assemblies canprovide some or all of the exterior surfaces of the device, and thusdefine the outer periphery form or look and feel of the electronicdevice. In particular, the front cover can substantially form the frontsurface of the device, the back cover can substantially form the backsurface of the device, and the outer periphery member can substantiallyform the top, bottom, left and right surfaces of the device. It will beunderstood, however, that some or all of the cover assemblies caninstead or in addition provide part of the top, bottom, left or rightsurfaces of the device, and that some or all of the outer peripherymember can provide part of the front or back surfaces of the device.

Because the cover assemblies can define exposed surfaces of theelectronic device, one or both of the cover assemblies can includecomponents, coatings or finishes that enhance the functional, cosmeticand/or aesthetic characteristics of the assemblies. For example, one orboth of the cover assemblies can include a transparent or translucentwindow through which input/output components are able to be used by theuser. For example, one output component that can be used is a displaydevice that can present information to the user via the cover assembly.As another example, one input component that can be used is a touchsensor (e.g., touch sensor) that can receive user input from the uservia the cover assembly. As another example, one or both of the coverassemblies can include a cosmetic component for enhancing the aestheticappeal of the device. In some embodiments, the cosmetic component cancause the cover assembly to be substantially opaque in some areas (e.g.,on a back cover assembly), yet transparent or translucent in other areas(e.g., on a front cover assembly through which content generated by thedisplay device is provided). In other words, the cover assembly caninclude a transparent or translucent window that is provided on aportion of the cover assembly. The cover assemblies can also supportother function features, such as a camera opening, a lens, a light, asensor, etc.

Internal components of the electronic device can be assembled using anysuitable approach. In some embodiments, the internal components candefine one or more layers that are placed within the outer peripherymember. For example, layers can initially be placed near the center ofthe volume defined by the outer periphery member, and subsequently beadded towards one or both of the front and back surfaces of the device.Each layer added to the device can be coupled or fit to a layerpreviously inserted and attached to the device.

To further retain component layers, the electronic device can include aninternal platform providing a structural element for the outer peripherymember and to which component layers can be coupled. In someembodiments, the internal platform can provide attachment points for thevarious layers placed within the electronic device. The internalplatform may be placed within the height of the outer periphery membersuch that it is substantially near the middle of the outer peripherymember (e.g., at half the height of the outer periphery member), thusdefining a mid-plate. In particular, the mid-plate can form asubstantially H-shape cross-section with the outer periphery member,thus providing enhanced structural properties. Electronic devicecomponents or layers can be assembled to both the front and backsurfaces of the mid-plate (e.g., the mid-plate separates the internalvolume of the outer periphery member into two distinct regions orpockets). The mid-plate can be secured to the outer periphery member(e.g., using welding, or formed with or made integral with the outerperiphery member. Although called a plate or platform it will beunderstood that the internal platform can take a variety of non-planarforms, including various formations that include steps, offsets, curvedsurfaces, or combinations of these.

FIG. 1A is a cross-sectional view of an illustrative electronic devicestructure taken along the device width in accordance with oneembodiment. FIG. 1B is an exploded cross-sectional view of anillustrative electronic device taken along the device length inaccordance with one embodiment. FIG. 10 is a top view of an illustrativeelectronic device in accordance with one embodiment. FIG. 1D is a bottomview of an illustrative electronic device in accordance with oneembodiment. Electronic device 100 can include any suitable type ofelectronic device having a display, including for example a mediaplayer, a mobile telephone, a personal e-mail or messaging device,pocket-sized personal computers, personal digital assistants (PDAs), alaptop computer, a desktop computer, a music recorder, a video recorder,a camera, radios, medical equipment, and devices combining some or allof this functionality.

Electronic device 100 can have any suitable shape, including for examplea shape delimited by front surface 110, back surface 112, left surface114, right surface 116, top surface 118 and bottom surface 119 (notshown in the cross-section). Each surface can be substantially planar,curved, or combinations of these. The surfaces can include one or morechamfers, detents, openings, dips, extensions, or other featuresmodifying the smoothness of the surfaces.

Electronic device 100 can be constructed using any suitable structure,including for example using outer periphery member 120. Outer peripherymember 120 can surround or wrap some or all of the electronic devicesuch that the outer periphery member defines an internal volume 122 intowhich electronic device components can be placed. For example, outerperiphery member 120 can wrap around the device such that the externalsurfaces of outer periphery member 120 define left surface 114, rightsurface 116, as well as top surface 118 and bottom surface 119 of thedevice. To provide a desired functionality to a user, the electronicdevice can include several components placed within the device, forexample within volume 122.

The outer periphery member can have a particular height (e.g., thedevice height h) such that the outer periphery member encloses volume122 into which electronic device components can be assembled. Thethickness (e.g., outer periphery member thickness t), length (e.g.,device length I), height (e.g., device height h), and cross-section ofthe outer periphery member can be selected based on any suitablecriteria including for example based on structural requirements (e.g.,stiffness, or resistance to bending, compression, tension or torsion inparticular orientations). In some embodiments, the outer peripherymember can serve as a structural member to which other electronic devicecomponents can be mounted. The outer periphery member can include one ormore depressions, recesses, channels, protrusions, or openings forsupporting components or for providing structural support for thedevice. In some embodiments, an opening can be used to provide access toone or more internal components contained within the outer peripheralmember.

Outer periphery member 120 (or device 100) can have any suitablecross-section. For example, outer periphery member 120 can have asubstantially rectangular cross-section. In some embodiments, outerperiphery member 120 can instead or in addition have a cross-section ina different shape, including for example a circular, oval, polygonal, orcurved cross-section. In some embodiments, the shape or size of thecross-section can vary along the length or width of the device (e.g., anhourglass shaped cross-section).

Electronic device components can be placed within volume 122 using anysuitable approach. For example, electronic device 100 can includecomponents 130 and 132 can be inserted into volume 122. Each ofcomponents 130 and 132 can include individual components, or severalcomponents assembled together as a component layer or stack, or includeseveral distinct layers of components to insert within volume 122. Insome embodiments, components 130 and 132 can each represent severalcomponents stacked along the height of the device. The component layerscan be electrically coupled to each other to enable data and powertransfers, as required for the proper operation of electronic device100. For example, the component layers can be electrically coupled usingone or more of a PCB, flex, solder, SMT, wires, connectors, orcombinations of these. The component layers can be inserted into outerperiphery member 120 using any suitable approach. For example,components 130 and 132 can all be inserted from front surface 110 orfrom back surface 112 (e.g., back to front, front to back, or middle tofront and back). Alternatively, the components can be inserted from bothfront surface 110 and back surface 112.

In some embodiments, one or more of the components can serve as astructural element. Alternatively, electronic device 100 can include adistinct structural element placed within volume 122 and coupled toouter periphery member 120. For example, electronic device 100 caninclude one or more internal member or platform 140, which can serve asa mounting points or regions for helping secure, hold or pack one ormore component layers (e.g., attaching component 130 to the back surfaceof internal platform 140, and component 132 to the front surface ofinternal platform 140). Internal platform 140 can be coupled to outerperiphery member 120 using any suitable approach, including for exampleusing snaps, fasteners, flexures, welds, glue, or combinations of these.Alternatively, internal platform 140 may even be part of the outerperiphery member (e.g., machined, extruded, or cast, or integrallyformed as a single unit). The internal platform can have any suitablesize, including for example a size that is smaller than the internalvolume of outer periphery member 120.

Internal platform 140 can be positioned at any suitable height withinouter periphery member 120, including for example substantially at halfthe height of outer periphery member 120. The resulting structure (e.g.,outer periphery member 120 and internal platform 140) can form anH-shaped structure that provides sufficient stiffness and resistance totension, compression, torsion and bending.

The internal platform, inner surfaces of the outer periphery members, orboth can include one or more protrusions, depressions, shelves,recesses, channels, or other features for receiving or retainingelectronic device components. In some cases, the internal platform,outer periphery member or both can include one or more openings forcoupling components located in the front and back regions. The size ofeach region can be selected based on any suitable criteria, includingfor example operational needs of system, numbers and types of electricalcomponents in the device, manufacturing constraints of the internalplatform, or combinations of these. The internal platform can beconstructed as a distinct component constructed from any suitablematerial (e.g., plastic, metal or both), or instead defined from anexisting electronic device component placed within the volume defined bythe outer periphery member. For example, the internal platform can beformed by a printed circuit board or chip used by the device.

In some embodiments internal platform 140 and/or opening 122 can includeone or more electrically conductive elements for providing electricalconnections between the components. For example, internal platform 140and/or opening 122 can include one or more PCB, flex, wire, solder pad,cable, connector, or other electrically conductive mechanism forconnecting components within the electronic device.

Electronic device 100 can include front cover assembly 150 and backcover assembly 160 defining the front and back surfaces, respectively,of electronic device 100. The front and back cover assemblies caninclude one or more components, or can include at least a front memberand a back member that form some or all of the outer front and backsurfaces of the device. Front and back cover assemblies 150 and 160 canbe flush, recessed or protruding relative to the front and back surfacesof outer periphery member 120. In some embodiments, one or both of frontand back cover assemblies 150 and 160 can include delicate or fragilecomponents. To protect the components from damage during use or whendropped, one or both of the cover assemblies can be flush or sub-flushrelative to the outer periphery member to prevent edges from engagingother surfaces. Alternatively, the one or more of the cover assembliescan be “proud” (i.e., protrude above the edge of the outer peripheralmember). In some embodiments, one or both of front cover assembly 150and back cover assembly 160 can include one or more display regionsthrough which one or more display devices can be viewed. The one or moredisplay regions can be defined by boarders provided by coating or finishcan be applied the front member or the back member. Similarly, thecoating or finish can also be applied to the front member or the backmember can also provide a masking effect to hide internal components.

In some embodiments, the electronic device can be substantially made ofglass. For example, portions of the electronic device housing can haveat least 75% of its exterior as glass. In one implementation, one orboth of the cover assemblies can be glass while side surface are somematerial other than glass (e.g., metal, plastic).

In some embodiments, the housing a portable electronic device can bebanged or rub against various surfaces. When plastic or metal housingsurfaces are used, the surfaces can tend to become scratched. On theother hand, glass housing surfaces (e.g., glass cover assemblies) can bemore scratch resistant. Moreover, glass housing surfaces can offer radiotransparency, while metal housing surfaces can disturb or hinder radiocommunications. In one embodiment, an electronic device housing can useglass housing members (e.g., glass cover assemblies) for a front surfaceand a back surface of the electronic device housing. For example, afront surface formed from a glass housing member can be transparent toprovide visual access to a display device positioned behind the glasshousing member at the front surface, while a back surface formed from aglass housing member can be transparent or non-transparent.Non-transparency, if desired, can conceal any interior components withinthe electronic device housing. In one embodiment, a surface coating orfilm can be applied to the glass housing member to providenon-transparency or at least partial translucency. Such a surfacecoating or film can be provided on an inner surface or an outer surfaceof the glass housing member.

In some embodiments, one or both of front and back cover assemblies 150and 160 can provide side protection for the front and back members. Whenthe front member is formed of glass, the side protection can serve toprotect the front member from damage if subjected to impact forces. Whenthe back member is formed of glass, the side protection can serve toprotect the back member from damage if subjected to impact forces.

In some embodiments, one or both of front and back cover assemblies 150and 160 can provide attachment members that can serve to attach frontand back cover assemblies 150 and 160. For example, front cover assembly150 can include attachment members to attach front cover assembly 150 tointernal platform 140 and/or outer periphery member 120. Back coverassembly 160 can include attachment members to attach back coverassembly 160 to internal platform 140 and/or outer periphery member 120.

In some embodiments, one or both the front and back members of front andback cover assemblies 150 and 160 can be formed of glass. The front orback member formed primarily of glass can include one or more pieces ofglass. For example, the different pieces of glass can have differentconfigurations, optical properties, and/or cosmetic appearance.

FIG. 2A is a schematic perspective view of an illustrative electronicdevice in accordance with one embodiment. FIG. 2B is an exploded view ofthe electronic device of FIG. 2A in accordance with one embodiment. FIG.2C is a cross-sectional view of the electronic device of FIG. 2A inaccordance with one embodiment. The electronic device of FIGS. 2A-2C caninclude some or all of the features of the electronic device of FIGS.1A-1D. In particular, components having similar numbers can share someor all features. Outer periphery member 220 can surround the peripheryof electronic device 200 to form some or all of the outer-most side, topand bottom surfaces (e.g., surfaces 210, 212, 214, 216, 218 and 219) ofthe electronic device. Outer periphery member 220 can have any suitableshape, including for example one or more elements that can be combinedto form a ring. The ring-shape of outer periphery member 220 can enclosevolume 222 in which electronic device components can be assembled andretained. The shape of outer periphery member 220 can define theboundaries of volume 222, and therefore can be determined based on thesize and type of components placed within volume 222. The boundaries ofvolume 222 (e.g., determined by the shape of outer periphery member 220)can have any suitable shape, including for example a substantiallyrectangular shape (e.g., having straight or rounded edges or corners), acircular shape, an oval shape, a polygonal shape, or any other closedshape that can define a volume.

Outer periphery member 220 can have any suitable size, which can bedetermined based on any suitable criteria (e.g., aesthetics orindustrial design, structural considerations, components requires for adesired functionality, or product design). The outer periphery membercan have any suitable cross-section, including for example a variablecross-section or a constant cross-section. In some embodiments, thecross-section of the ring can be selected based on desired structuralproperties for the outer periphery member. For example, thecross-section of outer periphery member 220 can be substantiallyrectangular, such that the height of the outer periphery member issubstantially larger than the width of the outer periphery member. Thiscan provide structural stiffness in compression and tension, as well asbending.

In some embodiments, the dimensions of the outer periphery membercross-section can be determined relative to the dimensions of theinternal platform cross section. For example, the outer periphery memberheight can be in a range of 5 to 15 times the height of the internalplatform, for example 8 to 12 times, 9 to 11 times, or approximately 10times the height of the internal platform. In one implementation, theheight of the outer periphery member can be approximately 9 mm, and theheight of the internal platform can be approximately 0.9 mm.

As another example, the width of the outer periphery member can be in arange of 8 to 25 times the width of the internal platform, for example12 to 20 times, 15 to 18 times, or approximately 16 times the internalplatform width. For example, the width of the outer periphery member canbe 3 mm and the width of the internal member can be 50 mm. In someembodiments, the height of the internal platform can be related to thewidth of the outer periphery member. For example, the width of the outerperiphery member can be 1 to 8 times the height of the internalplatform, such as 2 to 6 times or approximately 4 times the height ofthe internal platform. In one implementation, the height of the internalplatform can be approximately 0.7 mm and the width of the outerperiphery member can be approximately 2.5 mm. In some embodiments, theheight of the outer periphery member can be related to the width of theinternal platform. For example, the width of the internal platform canbe 3 to 10 times the height of the outer periphery member, such as 4 to8 times, 5 to 7 times, or approximately 6 times the height of the outerperiphery member. For example, the width of the internal platform can beapproximately 5.5 mm and the height of the outer periphery member can beapproximately 0.9 mm.

In some embodiments, outer periphery member 220 can include one or moreopenings, knobs, extensions, flanges, chamfers, or other features forreceiving components or elements of the device. The features of theouter periphery member can extend from any surface of the outerperiphery member, including for example from internal surfaces (e.g., toretain internal components or component layers), or from externalsurfaces. In particular, outer periphery member 220 can include a slotor opening 224 for receiving a card or tray within the device. Opening224 can be aligned with one or more internal components operative toreceive and connect to an inserted component (e.g., an inserted SIMcard). As another example, outer periphery member 220 can includeconnector opening 225 (e.g., for a 30-pin connector) through which aconnector can engage one or more conductive pins of electronic device200. Outer periphery member 220 can include openings 226 and 227 forproviding audio to a user (e.g., an opening adjacent to a speaker), orreceiving audio from a user (e.g., an opening adjacent to a microphone).Outer periphery member 220 can instead or in addition include an openingfor an audio connector or power supply (e.g., opening 228), or features229 for retaining and enabling a button such as a volume control orsilencing switch.

The various features of outer periphery member 220 can be constructedusing any suitable approach and at any suitable time. In someembodiments, the features can be constructed as part of a process thatcreates outer periphery member 220 from a single piece of material thatis manufactures into the final shape of outer periphery member 220(e.g., using a machining process). In some embodiments, several piecesof material can instead or in addition be shaped individually andcombined into outer periphery member 220. The various features can thenbe created as part of each individual piece, or once the entire outerperiphery member has been assembled. Outer periphery member 220 can beconstructed from any suitable material, including for example a metal(e.g., steel or aluminum), plastic (e.g. polyurethane, polyethylene orpolycarbonate), composite material, or any combination thereof. In someembodiments, outer periphery member 220 can be constructed from thecombination of several materials.

In some embodiments, outer periphery member 220 can have a functionaluse or purpose in addition to serving as a cosmetic component or as astructural component. For example, outer periphery member 220 can beused as part of an antenna for capturing electromagnetic waves radiatedas part of a communications network. In some cases, outer peripherymember 200 can be used as parts of more than one antenna.

In some embodiments, one or more portions of outer periphery member 220can be treated to provide an aesthetically pleasing component. Inparticular, left surface 214, right surface 216, top surface 218, andbottom surface 219 can be treated using a cosmetic surface treatmentsuch as, for example, polishing, coating (e.g., using a dye or coloringmaterial, or a material providing an optical effect), glazing, thin filmdeposition, grinding, superfinishing, or any other suitable process. Insome embodiments, front or back surfaces of outer periphery member 220can instead or in addition be provided with a cosmetic treatment (e.g.,for regions of the outer periphery member that may not be covered byback and front cover assemblies 250 and 260).

To reduce the overall weight, size or both of electronic device 200, thethickness of outer periphery member 220 can be selected such that outerperiphery member 220 is only minimally resistant to one or more ofbending, torsion, tension, compression, or other deformation of theband. For example, outer periphery member 220 can be more resistant totension and compression, but less resistant to bending or torsion. Toprovide sufficient resistance to all types of deformation, electronicdevice 200 can include a structural component placed within volume 222.In some embodiments, one or more of the internal components of theelectronic device can be connected to the outer periphery member andserve as a structural component. For example, a circuit board (with orwithout a separate stiffening element) can be connected to oppositeportions of outer periphery member 220. Alternatively, a distinct anddedicated structural component can be coupled to outer periphery member220. In the example of FIGS. 2A-2C, electronic device 200 can includeinternal platform 240 forming a distinct structural component of theelectronic device. Internal platform 240 can include any suitable shape,including for example a substantially planar shape. In some embodiments,internal platform 240 can include several distinct regions, such as aprimary region and step regions extending from the primary region toengage one or more features of outer periphery member 220.

Internal platform 240 can cover any suitable area within volume 222.Internal platform 240 can include any suitable features for securing orconnecting electronic device components, such as one or more snaps,prongs, chamfers, extends, openings, access points, doors, orcombinations of these. In some cases, internal platform 240 can includeone or more dedicated features for receiving or securing specificelectrical components, such as speakers, microphones, audio jacks,cameras, light sources, chips, or combinations of these.

Internal platform 240 can be constructed using any suitable approach. Insome embodiments, internal platform 240 can be constructed from a singlematerial or as a combination of several materials. For example, internalplatform 240 can include one or more metal elements (e.g., included inextensions used to connect internal platform 240 to outer peripherymember 220) around which a plastic can be molded to form internalplatform 240. Some portions of the metal elements of internal platform240 can extend beyond the edges of the plastic periphery so that theinternal platform can be coupled to the outer periphery member via themetal elements. For example, the exposed metal elements can be connectedto the outer periphery member using welding, soldering, heat staking, anadhesive, tape, a fastener, or any other connection mechanism. The outerperiphery member can include one or more counterpart features oninternal surfaces of the outer periphery member for retaining orreceiving internal platform 240. The connection between the metallicportions of internal platform 240 and outer periphery member 220 canserve to ground particular electronic device components (e.g.,components 230 and 232).

Internal platform 240 can be coupled to any suitable portion of outerperiphery member 220. For example, internal platform 240 can beassembled within the height of outer periphery member 220 (e.g., basedon the position of contact points or regions of the outer peripherymember). The distribution of the contact points can be selected based onstructural considerations, including for example based on a desiredresistance to torsion or bending. In particular, the electronic devicecan include at least four contact points or regions distributed withinouter periphery member 220 (e.g., near the corners of the outerperiphery member). As another example, internal platform 240 can includecontact regions along the straight portions of outer periphery member240. As still another example, stepped regions of internal platform 240can be coupled to the front or back surfaces of outer periphery member220 (e.g., on opposite portions of the front or back surfaces).

In some embodiments, internal platform 240 can be placed within theheight of outer periphery member 240 such that components 230 and 232can be placed on both the front and back surfaces of internal platform240. For example, components 230 can be inserted from back surface 212,and components 232 can be inserted from front surface 210. Components230 and 232 can be coupled to internal platform 240 for security, andcan instead or in addition be electrically connected to each otherthrough an opening in internal platform 240. In some embodiments, somecomponents 230 and 232 can first be coupled to back and front coverassemblies 250 and 260, respectively, before being inserted in volume222 and coupled to outer periphery member 220. In effect, by itsposition internal platform 240 can define back and front pockets orregions within volume 222 in which electronic device components can beplaced. The size of each pocket or region can be determined based on anysuitable criteria, including for example the number and size ofcomponents to place in each region, the required position of internalplatform 240 relative to outer periphery member 220 (e.g., if availablepositions are limited due to structural requirements), or combinationsof these.

To retain components within volume 232, electronic device 200 caninclude front cover assembly 250 and back cover assembly 260 providingthe back and front surfaces of the electronic device, respectively. Eachcover assembly can be coupled to outer periphery member 220 using anysuitable approach, including for example using an adhesive, tape,mechanical fastener, hooks, tabs, or combinations thereof.

In some embodiments, one or both of cover assemblies 250 and 260 can beremovable, for example for servicing or replacing electronic devicecomponents (e.g., a battery). In some embodiments, cover assemblies 250and 260 can include several distinct parts, including for example afixed part and a removable part. The inner surfaces of front coverassembly 250 and back cover assembly 260 can include any suitablefeature, including for example one or more ridges, hooks, tabs,extensions, or any combination thereof for retaining the covers orensuring proper alignment of the covers. The features of coverassemblies 250 and 260 can interact with corresponding features of outerperiphery member 220) or other components of the electronic device toensure proper placement of the covers. Front cover assembly 250 and backcover assembly 260 can be positioned in any suitable manner relative toouter periphery member 220.

Back cover assembly and front cover assembly can be coupled to anysuitable portion of outer periphery member. In some embodiments, backcover assembly and front cover assembly can be connected relative toouter periphery member in the same or different manners. In the exampleof electronic device, both back cover assembly and front cover assemblycan be positioned over the back and front surfaces, respectively, ofouter periphery member. In some embodiments, one or both of back coverassembly and front cover assembly can only partially cover back surfaceand front surface, respectively. For example, one or both of back coverassembly and front cover assembly can be placed within the periphery ofouter periphery member (e.g., recessed within the outer peripherymember).

Returning to electronic device 200 (FIGS. 2A-2C), back cover assembly260 and front cover assembly 250 can be constructed from any suitablematerial or combination of materials. In some embodiments, each of coverassemblies 250 and 260 can be constructed by combining several distinctcomponents. For example, one or both cover assemblies can include atransparent or translucent plate (e.g., a rectangular plate of glass).As another example, one or both cover assemblies can include a base orsupport structure constructed from one or more of a metal or plastic(e.g., aluminum) onto which a transparent component can be assembled.The transparent component can be assembled using any suitable approach,including for example such that one or more electronic device componentscan be visible through the transparent component (e.g., displaycircuitry), or can receive signals or detect a user's environmentthrough the transparent component (e.g., sensors). Alternatively, one ormore portions of the transparent plate can be rendered opaque (e.g.,using an ink, or by placing a support structure behind the transparentplate) such that the transparent plate can primarily serve as a cosmeticcomponent. The different components of each cover assembly can beassembled using any suitable approach, including for example using oneor more of an adhesive, fastener, tape, interlocking components,overmolding or manufacturing process, or any combination of these.

In the example of FIGS. 2A-2C, front cover assembly 250 can includesupport structure 252 on which glass plate 254 is assembled. Supportstructure 252 can include one or more openings, including an openingthrough which display 255 can be provided. In some embodiments, supportstructure 252 and glass plate 254 can include openings for devicecomponents, such as button opening 256 and receiver opening 257. Thesize and shape of the openings can be selected using any suitableapproach, including for example based on the size and shape of thedevice components placed in or underneath the openings (e.g., opening256 can determined by the size of the button, while opening 257 can bedetermine from the size of the receiver, and acoustic considerations forproviding sufficient audio to a user).

In some embodiments, glass plate 254 can include a cosmetic finishhiding from view internal components of the electronic device. Forexample, an opaque layer can be applied region 259 surrounding display255 to hide from view the non-display portions of the display circuitry.Because one or more sensors may receive signals through glass plate 254,the opaque layer can be selectively removed, or selected to allowsignals to pass through the glass plate to the sensor behind the plate.For example, glass plate 254 can include regions 259 a and 259 b throughwhich sensors (e.g., a camera, infrared sensor, proximity sensor, orambient light sensor) can receive signals.

In some embodiments, front cover assembly 250 can support or enable oneor more interfaces by which a user can use the electronic device. Forexample, glass plate 254 can support a touch interface (e.g., a touchpad or a touch screen) for controlling electronic device processes andoperations. As another example, front cover assembly 250 can include oneor more buttons or sensors (described above) for interacting with thedevice. In some cases, buttons, switches or other interface elements canbe instead or in addition incorporated in outer periphery member 220 orback cover assembly 260. Electronic device 200 can include any othersuitable interface for interacting with a user, including for exampledisplay circuitry, a projector, audio output circuitry (e.g., speakersor a an audio port), a haptic interface (e.g., a motor for creatingvibrations, or a power source for providing an electrical stimulus), orcombinations of these.

To enhance the cosmetic or aesthetic appeal of electronic device 200,one or all of outer periphery member 220, front cover assembly 250 andback cover assembly 260 can be finished using an appropriate process.For example, one or more of polishing, coating (e.g., using a dye orcoloring material, or a material providing an optical effect), glazing,thin film deposition, grinding, superfinishing, or any other suitableprocess can be applied to electronic device components. In someembodiments, one or more glass surfaces (e.g., of front cover assembly250 or of back cover assembly 260) can be finished to provide anaesthetically pleasing appearance, for example using one or more masks,coatings (e.g., photochromatic or dichroic), ink layers, or combinationsof these. The particular finishes applied to the glass surfaces of frontcover assembly 250 and back cover assembly 260 can be selected so thatfront and back surfaces 214 and 216 have similar or differentappearances. In some embodiments, a glass surface can be treated toresist wear or impacts (e.g., scratch resistance), oils from touching,or any other external force applied to the device.

FIG. 3 is a flowchart of an illustrative process for assembling anelectronic device in accordance with one embodiment of the invention.Process 300 can begin at step 302, an outer periphery member having aclosed loop can be obtained. For example, one or more components can becombined to form a loop. At step 304, an internal platform can beconnected to the outer periphery member. For example, an internal membercan be inserted within the loop of the band and connected to severalportions of the outer periphery member to define a structural component.At step 306, components for the electronic device can be provided withina volume at least partially defined by the outer periphery member. Thecomponents can be provided within the volume from one or both sides ofthe outer periphery member. For example, components can be coupled toboth sides of the internal platform. At step 308, cover assemblies canbe placed relative to the outer periphery member. For example, front andback cover assemblies can be connected to the outer periphery membersuch that the inserted components are contained within an enclosureformed by the outer periphery member and the front and back coverassemblies. In particular, the front and back cover assemblies can beplaced such that a display interface of the device remains visiblethrough a window of one of the covers. Process 300 can then end afterstep 308.

For additional information on the electronic device structure andassembly processing discussed above in FIGS. 1-3, see U.S. ProvisionalApplication No. 61/300,780, filed Feb. 2, 2010 and entitled “HANDHELDELECTRONIC DEVICES,” which is hereby incorporated herein by reference.

Alignment and Protection Arrangements and Techniques

With parts of an electronic device housing being arrangement in a stack,there can be cumulative tolerances which can make alignment lessprecise. According to one aspect, adjoining surfaces of electronicdevice housings can be mounted or arranged such that adjoining surfacesare flush to a high degree of precision. Edges of portable electronicdevices are susceptible to impact force, such as when dropped. Accordingto another aspect, protective sides can be provided on edges ofelectronic device housings so to dissipate impact forces and thus reducedamage to electronic device housings. According to still anotherembodiment, an electronic device housing can have one or more of itsexposed major surfaces (e.g., front or back surfaces) formed of glass.The glass surfaces can be protected by the protective sides and can bealigned so that the top surfaces of the glass surfaces and theprotective sides can be substantially flush.

FIG. 4 is a flow diagram of a housing member alignment process 400according to one embodiment of the invention. The housing memberalignment process 400 serves to allow adjacent housing members tosecured together while providing a flush interface therebetween.

The housing member alignment process 400 provides 402 an outer housingmember for a device housing, namely, an electronic device housing, canbe provided at an assembly region (e.g., assembly station). In addition,a protective side structural member having a receptive plane forreceiving the outer housing member can be provided 404.

The outer housing member can be positioned 406 adjacent to the receptiveplane of the protective side structural member. In order to ensureproper alignment to a high degree of flushness, a first force is applied408 to push the outer housing member against a planer reference surface.Here, the planer reference surface can pertain to a flat steel surfaceprovided at the assembly region. In one implementation, the planerreference surface can be coated with a non-stick coating (e.g. Teflon).Further, a second force can be applied 410 to push the protective sidestructural member against the planar reference surface. Typically, thesecond force can also push the protective side structural member againstthe outer housing member. The protective side structural member can thenbe secured 412 to the outer housing member. As a result, the outerhousing member and the protective side structural member, once secured412, can represent an assembled portion of the device housing.Thereafter, the assembled portion can be removed 414 from the assemblyregion. After the assembled portion has been removed 414, the housingmember alignment process 400 can end.

FIG. 5 is a structural diagram of an alignment configuration 500according to one embodiment. The alignment configuration 500 cancorrespond to alignment of adjacent housing members as discussed above,such as in the housing member alignment process 400 illustrated in FIG.4. The alignment configuration 500 includes a planar reference surface502 that is secured in a fixed manner. An outer housing member 504 canbe pushed against the planar reference surface 502 by a force F1. Theforce F1, as shown in FIG. 5, can be applied at various points on anopposing surface of the outer housing member 504. For example, in thisarrangement, a top surface of the outer housing member 504 can bepressed against a surface of the planar reference surface 502, and theforce F1 can be induced on a bottom surface of the outer housing member504. The force F1 can be applied as a single structure (e.g., spring) orbe a plurality of structures (e.g., series of springs). The use of aplurality of springs can provide more uniform application of forceacross the surface of the outer housing member 504. In addition, aprotective side structural member 506 can be provided adjacent to atleast one side of the outer housing member 504. To position theprotective side structural member 506 with respect to the outer housingmember 504, in a flush manner, a force F2 can operate to push theprotective side structural member 506 against the surface of the planarreference surface 502. The force F2 can be applied as a single structure(e.g., spring) or be a plurality of structures (e.g., series ofsprings). This insures that the top surface of the protective sidestructural member 506 will be positioned such that its top surface isflush with the top surface of the outer housing member 504.Additionally, if needed, a force F3 can be applied to push theprotective side structural member 506 against the side of the outerhousing member 504. Once the outer housing member 504 and the protectiveside structural member 506 are biased against the planar referencesurface 502, the outer housing member 504 and the protective sidestructural member 506 can be secured to one another. These members ofthe electronic device housing can be secured together in a variety ofdifferent ways. For example, these members can be held together by anadhesive, such as glue or epoxy, which can remained biased against theplanar reference surface 502 while the adhesive cures. As anotherexample, these members can be held together through mechanicalstructures (e.g. screws, snaps, tabs, detents, etc.).

FIG. 6 is a flow diagram of a housing member alignment process 600according to one embodiment of the invention. The housing memberalignment process 600 can combine together an outer housing member(namely, an outer glass member) and a protective side structural memberfor an electronic device housing. The housing member alignment process600 operates to align external surface of these members and then securethe members to one another.

The housing member alignment process 600 can provide 602 an outer classmember for an electronic device housing. A protective side structuralmember having a receptive plane for receiving the outer glass member canalso be provided. A liquid adhesive can then be applied 606 to a portionof the outer glass member and/or a portion of the protective sidestructural member. The outer glass member can then be positioned 608adjacent to the receptive plane of the protective side structuralmember. To impose accurate alignment that yields a high degree offlushness, a first force can be applied 610 to push the outer glassmember against a planar reference surface. A second force can also beapplied 612 to push the protective side structural member against theplanar reference surface. This ensures that the outer glass member andthe protective side structural member are positioned such that a topsurface of both are tightly adjacent and flush. Thereafter, the liquidadhesive can be cured 614. For example, the members being assembledtogether into an assembled part can be placed in an oven to acceleratethe curing of the liquid adhesive. Once the protective side structuralmember and the outer glass member are secured by the cured adhesive, theassembled part can be removed 606 from the oven and the first and secondforces can be removed. At this point, the assembled part includes theouter glass member together with the protective side structural member.Additionally, given the manner in which the members were assembled intothe assembled part, the top surface of the outer glass member is flushwith new top surface of the protective side structural member. Followingthe block 616, a housing member alignment process 600 can end.

In one embodiment, the flushness provided by the alignment processingcan be not more than at most 80 mm from being precisely plush. Inanother embodiment, the flushness provided by the alignment processingcan be not more than 60 mm from being precisely flush. In still anotherembodiment, the flushness provided by the alignment processing can benot more than 40 mm from being precisely flush.

FIGS. 7A-7D illustrate assembly of an assembled part according to oneembodiment. The assembled part can be assembled in accordance with thehousing member alignment process 600. The assembled part can represent apart for an electronic device housing.

FIG. 7A illustrates component members for the assembled part.Specifically, the component parts include an outer glass member 700 anda protective side structural member 702. The protective side structuralmember 702 has an upper surface 704 that can received the outer glassmember 700 when assembled, and a bottom surface 706 that provides aninner surface for the electronic device housing. The protective sidestructural member 702 also includes side bumpers 708 that having topsurfaces 710.

FIG. 7B illustrates an initial assembly step for the assembled part. Theouter glass member 700 is held against a fixed reference structure 712.The top surface of the outer glass member 700 is pressed against a flatreference surface provided by the fixed reference structure 712. Theoutput glass member 700 can be biased (i.e., pressed) against the flatreference surface by a mechanical member (e.g., spring(s)) that providesa biasing force. Additionally, the protective side structural member 702can have liquid adhesive 714 deposited on a portion of the upper surface704.

FIG. 7C illustrates a subsequent step for the assembled part. Here, theprotective side structural member 702 with the liquid adhesive 714 canbe pressed against the flat reference surface provided by the fixedreference structure 712. More specifically, the top surface 710 of theside bumpers 708 of the protective side structural member 702 is pressedagainst the flat reference surface. The protective side structuralmember 702 can be biased (i.e., pressed) against the flat referencesurface by a mechanical member (e.g., spring(s)) that provide a biasingforce. The protective side structural member 702 can be biased (i.e.,pressed) against the flat reference surface by a mechanical member(e.g., spring(s)) that provide a biasing force. The mechanical memberbiasing the protective side structural member 702 is separate from themechanical member biasing the outer glass member 700. Once the assembledpart is held in position, as shown in FIG. 7C, by the biasing forces,the liquid adhesive can be cured. In one embodiment, the adhesive can becured using heat, such as by placing the assembled part in an oven. Theadhesive being cured serves to secure the parts (i.e., the outer glassmember 700 and the protective side structural member 702) whilecompensating for tolerances of parts (e.g., in a component stack ofparts) so that the top surface of the outer glass member 700 and the topsurface 710 of the side bumpers 708 are flush. In one embodiment, flushmeans that the adjacent top surfaces are within 60 micrometers of beingperfectly flush. Once the adhesive is cured, the heat can be removed andthe assembled part is now assembled. Additionally, the side bumpers 708of the protective side structural member 702 are tightly adjacent thesides (e.g., edges) of the outer glass member 700 and provide a barrierto impact forces at the sides of the glass member 700.

FIG. 7D illustrates a subsequent assembly for the assembled part. Theassembled part can be attached to another structural component of theelectronic device housing. As an example, the another structuralcomponent can pertain to an outer periphery member 716 for theelectronic device housing. The outer periphery member 716 can define aside surface for the electronic device housing. The outer peripherymember 716 can also attach or be integral with an internal structure 718(e.g., internal platform) that provides structural stiffness for theelectronic device housing. For example, the internal structure 718 canbe secured to an inner surface of the outer periphery member 716. Theinternal structure 718 can be positioned offset from front and backplanar boundaries of the outer periphery member 716. As shown in FIG.7D, the assembled part can be coupled to the outer periphery member 716at the front planar boundary. To secure the assembled part, theprotective side structural member 702 can further include or couple toattachment arms 720. The attachment arms 720 can abut against an innersurface of the outer periphery member 716 and be secured thereto byadhesive or mechanical means (e.g., screws, tabs, snaps, etc.).

The assembled part can have parts of glass, polymer and/or metal. In oneparticular embodiment, the outer glass member 700 is glass, such asalumino-silicate glass; the protective side structural member 702 ispolymer, such as polyarylamide; and the outer periphery member 716, theinternal structure 718 and the attachment arms can be metal, such asstainless steel.

FIG. 8A is a side view of a partial side portion of an electronic devicehousing 800 according to one embodiment. The partial side portionincludes an outer housing member 802. The outer housing member 802 canabut against a side member 804. In addition, a protective side bumper806 can be provided to protect an otherwise exposed side 808 of theouter housing member 802. The configuration of the protective sidebumper 806 can vary with implementation. Typically, the thickness of theprotective side bumper 806 is thin at the portion adjacent the exposedside 808. For example, where the thickness of the outer housing member802 is 1 millimeter (mm), the thickness of the protective side bumper806 can be less than 1 mm, more particularly the thickness can be about0.8 mm. In one embodiment, the outer housing member 802 can be made ofglass, the protective side bumper 806 can be made of a polymer, and theside member 804 can be made of metal.

FIG. 8B is a side view of a partial side portion of an electronic devicehousing 800′ according to another embodiment. Similar to FIG. 8A, theouter housing member 802 can abut against a side member 804. Theprotective side bumper 806 can be provided to protect an otherwiseexposed side 808 of the outer housing member 802. In this embodiment,the side member 804′ can extend outward slightly from the outer surfaceof the protective side bumper 806. In one embodiment, the outer housingmember 802 can be made of glass, the protective side bumper 806 can bemade of a polymer, and the side member 804′ can be made of metal.

FIG. 8C is a side view of a partial side portion of an electronic devicehousing 820 according to another embodiment. The partial side portionincludes an outer housing member 822. The outer housing member 820 canabut against a side member 824. In this embodiment, the side member 824supports the outer housing member 822 and also provide a protective sidebumper 826 can be provided to protect an otherwise exposed side 828 ofthe outer housing member 822. The configuration of the protective sidebumper 826 can vary with implementation. Typically, the thickness of theprotective side bumper 806 is thin at the portion adjacent the exposedside 828. For example, where the thickness of the outer housing member822 is 1 millimeter (mm), the thickness of the protective side bumper826 can be less than 1 mm, more particularly the thickness can be about0.8 mm. The side member 824 can couple to an internal structure 830 toprovide support for the side member 824 of the electronic devicehousing. The internal structure 830 can, in one embodiment, include aside portion 832 embedded in the side member 824. In one embodiment, theouter housing member 822 can be made of glass, the side member 824 aswell as the protective side bumper 826 can be made of a polymer, and theinternal structure 830 (including side structure 832) can be made ofmetal.

FIG. 8D is a side view of a partial side portion of an electronic devicehousing 840 according to still another embodiment. The electronic devicehousing 840 is similar to the electronic device housing 820 illustratedin FIG. 8C but provides another outer housing member 842. For example,the outer housing member 822 can correspond to a top cover for theelectronic device housing, and the outer housing member 842 cancorrespond to a bottom cover for the electronic device housing. The sidemember 824′ includes not only the protective side bumper 826 but also aprotective side bumper 844.

FIG. 9A is a cross-sectional view of an electronic device housing 900according to one embodiment. The electronic device housing 900 includesan outer housing member 902 supported and protected by an interfacemember 904. The interface member 904 providing protective side members906 (e.g., protective side bumpers) positioned tightly adjacent sides ofthe outer housing member 902. The interface member 904 also supports theouter housing member 902 and serves to secure the outer housing member902 to other portions of the electronic device housing 900. In thisembodiment, the interface member 904 is secured to an outer peripherymember 908. More particularly, in this embodiment, the interface member904 includes securing features 910 (e.g., attachment arms) that are usedto secure the interface member 904 (and thus the outer housing member902) to the outer periphery member 908. The electronic device housing900 can also include another outer housing member 912. The another outerhousing member 912 can, for example, be integral with or secured to theouter periphery member 908 on a side opposite the outer housing member902. An internal space 914 is provided internal to the electronic devicehousing 900 whereby various electrical components can be attached,affixed or placed so as to provide electronic operations for theelectronic device.

The various members, parts or assemblies of the portable electronicdevice 900 can be formed of any of a variety of materials, e.g., glass,polymers or metal. In one embodiment, the outer housing member 902 isglass, the outer periphery member 908 is formed from metal or polymer(e.g., plastic), and the another outer housing member 912 is formed fromglass, polymer (e.g., plastic) or metal. The interface member 904 can beformed of a polymer or from a combination of materials. For example, theprotective side members 906 are to be strong; hence, a structurallystrengthened polymer, such as polyarylamide, can be utilized. Also as anexample, the securing features 910 can be formed from metal forincreased strength. The securing features 910 if formed of metal can becombined with the balance of the interface member 904 by an over-moldingprocess.

FIG. 9B is a cross-sectional assembly diagram for the electronic devicehousing 900 shown in FIG. 9A, according to one embodiment. The outerhousing member 902 has a top surface 920 and a bottom surface 922. Thebottom surface 922 of the outer housing member 902 can be secured to atop surface 924 of the interface member 904. For example, the outerhousing member 902 can be secured to the top surface 924 of theinterface member 904 using adhesive. When the outer housing member 902is secured to the interface member 904, the protective side members 906are positioned at the sides (i.e., edges) of the outer housing member902. The protective side member 906 provides a buffer layer (e.g.,bumper) that dampens impact induced at the sides of the outer housingmember 902 of the electronic device housing 900. In addition, a bottomsurface 926 of the interface member 904 is placed on a top surface 928of the outer periphery member 908. The securing features 910 of theinterface member 910 can be used to secure the interface member 904 tothe outer periphery member 908.

FIG. 10 is a cross-sectional view of an electronic device housing 1000according to one embodiment. The electronic device housing 1000 includesa first outer housing member 1002 supported and protected by a firstinterface member 1004. The first interface member 1004 providesprotective side members 1006 (e.g., protective side bumpers) positionedtightly adjacent sides of the first outer housing member 1002. The firstinterface member 1004 also supports the first outer housing member 1002and serves to secure the first outer housing member 1002 to otherportions of the electronic device housing 1000. In this embodiment, thefirst interface member 1004 is secured to an outer periphery member1008. More particularly, in this embodiment, the first interface member1004 includes first securing features 1010 that are used to secure thefirst interface member 1004 (and thus the first outer housing member1002) to the outer periphery member 1008.

The electronic device housing 1000 can also include an internalstructure 1012 that is integral with or secured to the outer peripheralmember 1008. In one embodiment, the internal structure 1012 can besecured to an inner surface of the outer periphery member 1008 such thatit is offset from front and back planar boundaries of the outerperiphery member 1008. As shown in FIG. 10, the internal structure 1012can be secured at the mid-point of the height of the outer peripherymember 1008. A first internal space 1014 is provided internal to theelectronic device housing 1000 whereby various electrical components canbe attached, affixed or placed so as to provide electronic operationsfor the electronic device.

In this embodiment, the electronic device housing 1000 also includessimilar structure on an opposite side of the electronic device housing1000. Namely, the electronic device housing 1000 can further include asecond outer housing member 1016 supported and protected by a secondinterface member 1018. The second interface member 1018 providesprotective side members 1020 (e.g., protective side bumpers) positionedtightly adjacent sides of the second outer housing member 1016. Thesecond interface member 1018 also supports the second outer housingmember 1016 and serves to secure the second outer housing member 1016 toother portions of the electronic device housing 1000. In thisembodiment, the second interface member 1018 can be secured to the outerperiphery member 1008 on the opposite side from the first interfacemember 1004. More particularly, in this embodiment, the second interfacemember 1018 includes second securing features 1022 (e.g., attachmentarm) that are used to secure the second interface member 1018 (and thusthe second outer housing member 1016) to the outer periphery member1008. Further, a second internal space 1024 is provided internal to theelectronic device housing 1000 (between the internal structure 1012 andthe second interface member 1018) whereby various electrical componentscan be attached, affixed or placed so as to provide electronicoperations for the electronic device.

In one embodiment, the first outer housing member 1002 can represent atop outer surface for the portable electronic device, and the secondouter surface housing 1016 can represent a bottom outer surface housing.In one embodiment, both the first outer housing member 1002 and thesecond outer housing member 1016 are glass (e.g., class covers).

In FIGS. 9A, 9B and 10, the protective side members (e.g., protectiveside bumpers) are thin layer of material positioned tightly adjacentsides of the outer housing member, thereby buffering impact at the sidesof the outer housing members. In one embodiment, the protective sidemembers are to be strong; hence, a structurally strengthened polymer,such as polyarylamide, can be utilized. The polyarylamide can bestrengthened by containing glass fibers. One source of strengthenedpolyarylamide is Ixef polyarylamide (PARA) from Solvay AdvancedPolymers, L.L.C which can contain glass fiber reinforcement.Additionally, since the protective side members are tightly adjacentsides of the outer housing member, the respective materials used for theprotective side members and the outer housing member. Specifically, theCoefficient of Thermal Expansion (CTE) of the respective materials, ifnot controlled, can produce undesired stress on the sides of the outerhousing member. For example, with an outer housing member of glass, itsCTE is about 10 millimeters/meter/° C. Hence, ideally, for this examplethe CTE of the material for the protective side members would be about10 millimeters/meter/° C. Although plastics tend to have CTE's (e.g.,roughly 100 millimeters/meter/° C.) that are dramatically higher thanthat of glass, some manufactured polymers, such as polyarylamide, canhave CTE's (e.g., roughly 30 millimeters/meter/° C.) that aresubstantially closer to that of glass and thereby would, if used, induceless stress on the sides of the outer housing member. For example, inone embodiment, a manufactured polymer for such use could have a CTEless than or equal to about 50 millimeters/meter/° C., and in anotherembodiment, a manufactured polymer for such use could have a CTE lessthan or equal to about 35 millimeters/meter/° C. Also, as noted above,the thickness of the protective side member can be thin, for example,the thickness can be not more than about 1 mm in one embodiment.

In still other embodiments, the protective side materials can be formedfrom multiple materials that can be alternated, intertwined or layered.The later of material against the edges of the outer housing member ofglass can have a CTE relatively close to that of glass while an outerlayer can have a higher CTE can permit a greater range of material, suchas polymers (e.g., plastics).

The protective side members are able to be thin yet be cosmeticallyunintrusive. For example, in some embodiments, the thickness (t1) forthe protective side member can be less than 1 mm (e.g., 0.8 mm). Also,in some embodiments, the thickness (t2) of the outer housing member canbe less than 5 mm (e.g., 1 mm). However, these thicknesses are exemplaryand vary with the size of the electronic device housing and with desiredstrength. Using a strengthened material for the protective side membersas noted above can also be advantageous. Nevertheless, the provisioningof thin protective side members for outer housing members, such as glasscovers, facilitates providing portable electronic device housings thatare compact and thin yet resistant to side impact damage to the outerhousing members.

FIGS. 11A, 11B and 12 are structurally similar to FIGS. 9A, 9B and 10,respectively. However, the configuration of the protective side membersis different. The protective side members illustrated in FIGS. 11A, 11Band 12 form corners for the electronic device housing and, therefore,are typically thicker than the protective side members illustrated inFIGS. 9A, 9B and 10. As an example, in one embodiment, the thickness ofthe protective side member is approximately the thickness of the outerhousing member.

FIG. 11 A is a cross-sectional view of an electronic device housing 1100according to one embodiment. The electronic device housing 1100 includesan outer housing member 1102 supported and protected by an interfacemember 1104. The interface member 1104 providing protective side members1106 (e.g., protective side bumpers) positioned tightly adjacent sidesof the outer housing member 1102. The interface member 1104 alsosupports the outer housing member 1102 and serves to secure the outerhousing member 1102 to other portions of the electronic device housing1100. In this embodiment, the interface member 1104 is secured to anouter periphery member 1108. More particularly, in this embodiment, theinterface member 1104 includes securing features 1110 (e.g., attachmentarms) that are used to secure the interface member 1104 (and thus theouter housing member 1102) to the outer periphery member 1108. Theelectronic device housing 1100 can also include another outer housingmember 1112. The another outer housing member 1112 can, for example, beintegral with or secured to the outer periphery member 1108 on a sideopposite the outer housing member 1102. An internal space 1114 isprovided internal to the electronic device housing 1100 whereby variouselectrical components can be attached, affixed or placed so as toprovide electronic operations for the electronic device.

The various members, parts or assemblies of the portable electronicdevice 1100 can be formed of any of a variety of materials, e.g., glass,polymer or metal. In one embodiment, the outer housing member 1102 isglass, the outer periphery member 1108 is formed from metal or polymer(e.g., plastic), and the another outer housing member 1112 is formedfrom glass, polymer (e.g., plastic) or metal. The interface member 1104can be formed of a polymer or from a combination of materials. Forexample, the protective side members 1106 are to be strong; hence, astructurally strengthened polymer, such as polyarylamide, can beutilized. The polyarylamide can be strengthened by containing glassfibers. Also as an example, the securing features 1110 can be formedfrom metal for increased strength. The securing features 1110 if formedof metal can be combined with the balance of the interface member 1104by an over-molding process.

FIG. 11B is a cross-sectional assembly diagram for the electronic devicehousing 1100 shown in FIG. 11A, according to one embodiment. The outerhousing member 1102 has a top surface 1120 and a bottom surface 1122.The bottom surface 1122 of the outer housing member 1102 can be securedto a top surface 1124 of the interface member 1104. For example, theouter housing member 1102 can be secured to the top surface 1124 of theinterface member 1104 using adhesive. When the outer housing member 1102is secured to the interface member 1104, the protective side members1106 are positioned at the sides (i.e., edges) of the outer housingmember 1102. The protective side member 1106 provides a buffer layer(e.g., bumper) that dampens impact induced at the sides of the outerhousing member 1102 of the electronic device housing 1100. In addition,a bottom surface 1126 of the interface member 1104 is placed on a topsurface 1128 of the outer periphery member 1108. The securing features1110 of the interface member 1110 can be used to secure the interfacemember 1104 to the outer periphery member 1108.

FIG. 12 is a cross-sectional view of an electronic device housing 1200according to one embodiment. The electronic device housing 1200 includesa first outer housing member 1202 supported and protected by a firstinterface member 1204. The first interface member 1204 providesprotective side members 1206 (e.g., protective side bumpers) positionedtightly adjacent sides of the first outer housing member 1202. The firstinterface member 1204 also supports the first outer housing member 1202and serves to secure the first outer housing member 1202 to otherportions of the electronic device housing 1200. In this embodiment, thefirst interface member 1204 is secured to an outer periphery member1208. More particularly, in this embodiment, the first interface member1204 includes first securing features 1210 that are used to secure thefirst interface member 1204 (and thus the first outer housing member1202) to the outer periphery member 1208.

The electronic device housing 1200 can also include an internalstructure 1212 that is integral with or secured to the outer peripheralmember 1208. In one embodiment, the internal structure 1212 can besecured to an inner surface of the outer periphery member 1208 such thatit is offset from front and back planar boundaries of the outerperiphery member 1208. As shown in FIG. 12, the internal structure 1212can be secured at the mid-point of the height of the outer peripherymember 1208. A first internal space 1214 is provided internal to theelectronic device housing 1200 whereby various electrical components canbe attached, affixed or placed so as to provide electronic operationsfor the electronic device.

In this embodiment, the electronic device housing 1200 also includessimilar structure on an opposite side of the electronic device housing1200. Namely, the electronic device housing 1200 can further include asecond outer housing member 1216 supported and protected by a secondinterface member 1218. The second interface member 1218 providesprotective side members 1220 (e.g., protective side bumpers) positionedtightly adjacent sides of the second outer housing member 1216. Thesecond interface member 1218 also supports the second outer housingmember 1216 and serves to secure the second outer housing member 1216 toother portions of the electronic device housing 1200. In thisembodiment, the second interface member 1218 can be secured to the outerperiphery member 1208 on the opposite side from the first interfacemember 1204. More particularly, in this embodiment, the second interfacemember 1218 includes second securing features 1222 (e.g., attachmentarms) that are used to secure the second interface member 1218 (and thusthe second outer housing member 1216) to the outer periphery member1208. Further, a second internal space 1224 is provided internal to theelectronic device housing 1200 (between the internal structure 1212 andthe second interface member 1218) whereby various electrical componentscan be attached, affixed or placed so as to provide electronicoperations for the electronic device.

In one embodiment, the first outer housing member 1202 can represent atop outer surface for the portable electronic device, and the secondouter surface housing 1216 can represent a bottom outer surface housing.In one embodiment, both the first outer housing member 1202 and thesecond outer housing member 1216 are glass (e.g., class covers).

In FIGS. 11A, 11B and 12, the protective side members (e.g., protectiveside bumpers) are thin layer of material positioned tightly adjacentsides of the outer housing member, thereby buffering impact at the sidesof the outer housing members. In these embodiments, the protective sidemembers are rounded at corners of the electronic device housing. Forexample, in some embodiments, the thickness (t3) for the protective sidemember can be less than 5 mm (e.g., 1 mm). Also, in some embodiments,the thickness (t4) of the outer housing member can be less than 5 mm(e.g., 1 mm). However, these thicknesses are exemplary and vary with thesize of the electronic device housing and with desired strength. Using astrengthened material for the protective side members as noted above canalso be advantageous. Nevertheless, the provisioning of thin protectiveside members for outer housing members, such as glass covers,facilitates providing portable electronic device housings that arecompact and thin yet resistant to side impact damage to the outerhousing members.

FIG. 13 is a flow diagram of an outer member assembly process 1300according to one embodiment of the invention. In this example, the outermember is an outer glass member. The outer glass member can be secured1302 to a protective side member. As an example, the processingperformed to secure the outer glass member to the protective side membercan, in certain embodiments, use the housing member alignment process400, 600 illustrated in FIGS. 4 and 6, respectively.

After the outer glass member has been secured 1302 to the protectiveside member, the glass assembly can be positioned 1304 in an opening ofan outer periphery member. After the glass assembly has been positioned,the glass assembly at the opening of the outer periphery member can besecured 1306. The glass assembly, namely, the outer glass member, canthus operate as an outer surface for the electronic device housing.Following the block 1306, the outer member assembly process 1300 canend.

In one embodiment, the outer glass member can represent a front (or top)surface of the electronic device housing. In another embodiment, theouter glass member can represent a back (or bottom) surface of theelectronic device housing. In general, the outer member assembly process1300 can represent processing suitable for any exposed surface of anelectronic device housing that is formed of a glass member. In stillanother embodiment, the electronic device housing may utilize an outerglass member for a front surface of the electronic device housing andmay utilize an outer glass member for a back surface of the electronicdevice housing.

As discussed above, such as in FIGS. 10 and 13, an electronic devicehousing can be substantially made of glass. For example, an electronicdevice housing might have at least 75% of its exterior as glass. In oneimplementation, front and bottom surfaces of an electronic devicehousing can be glass while side surface are some material other thanglass (e.g., metal, plastic).

In the case of portable electronic devices, housings are banged againstor rub against various surfaces. When plastic or metal housing surfacesare used, the surfaces tend to become scratched. On the other hand, withglass housing surfaces (e.g., glass covers), the surfaces are much morescratch resistant. Moreover, glass housing surfaces offer radiotransparency, while metal housing surfaces disturb or hinder radiocommunications. In one embodiment, an electronic device housing can useglass housing members (e.g., glass covers) for a front surface and aback surface of the electronic device housing. For example, a frontsurface formed from a glass housing member can be transparent to providevisual access to a display device positioned behind the glass housingmember at the front surface, while a back surface formed from a glasshousing member can be transparent or non-transparent. Non-transparency,if desired, can conceal any interior components within the electronicdevice housing. In one embodiment, a surface coating or film can beapplied to the glass housing member to provide non-transparency or atleast partial translucency. Such a surface coating or file can beprovided on an inner surface or an outer surface of the glass housingmember. The protective side members and the interface members discussedherein can be optionally used to protect and/or assembly the glasshousing members.

FIG. 14 is a side view of a partial side portion of an electronic devicehousing 1400. The partial side portion illustrates includes a firstinterface assembly 1402 and a second interface assembly 1404. Theinterface assemblies 1402, 1404 can also be referred to as interfacemembers. The interface assembly 1402 includes a support and protectionmember 1406 and an attachment member 1408. Similarly, the interfaceassembly 1404 includes a support and protection member 1410 and anattachment member 1412. The support and protection members 1406 cansupport a first outer housing member and provide a protective sidemember therefore as discussed above. Similarly, the support andprotection members 1410 can support a second outer housing member andprovide a protective side member therefore as discussed above. Theattachment member 1408 can serve to attach and secure the interfaceassembly 1402 to a side member 1414, and the attachment member 1412 canserve to attach and secure the interface assembly to the side member1414. An attachment device 1416 (e.g., screw, bolt) can be provided totightly secure the first support and protection member 1406 with respectto the side member 1414. Likewise, an attachment device 1418 (e.g.,screw, bolt) can be provided to tightly secure the second support andprotection member 1410 with respect to the side member 1414.

Although only a single attachment device 1416 is shown for theattachment member 1408, it should be understood that several attachmentdevices would ordinarily be used to reliable secure the first interfaceassembly 1402 to the side member 1414. Likewise, although only a singleattachment device 1418 is shown for the attachment member 1412, itshould be understood that several attachment devices would ordinarily beused to reliable secure the second interface assembly 1404 to the sidemember 1414. Also, although the embodiment illustrated in FIG. 14supports outer housing member at opposite ends, it should be understoodthat in other embodiments the electronic device housing may only use asingle outer housing member.

Attachment Structures and Techniques

According to another aspect, apparatus, systems and methods for robustlyattaching a cover portion of an electronic device to a bottom portion,e.g., a housing portion, of the electronic device are described. Thecover portion may generally include a frame (e.g., interface member)into which a glass member has been inserted. Attachment members (e.g.,arms, tabs) can be coupled to, e.g., insert molded into, a coverportion, and can be arranged to substantially engage with a housingportion such that the cover portion is effectively held against thehousing portion. The attachment members can be used to screw orotherwise fasten the cover portion to the housing. In general,receptacles of the housing portion are arranged to substantiallycapture, mate or otherwise engage attachment members of the coverportion.

In one embodiment, the cover portion is held against the housing portionsuch that a contact surface of the cover portion interfaces with acontact surface of the housing portion, e.g., such that there iseffectively no gap between the contact surfaces. More generally, thecover portion may be held against the housing portion such that the sizeof any space between the contact surface of the cover portion and thecontact surface of the housing portion may be controlled. For example,to hold the cover portion against the housing portion, a protrusion thatis a part of or is otherwise attached to the cover portion can beengaged with a receptacle that is a part of or is otherwise attached onthe housing portion.

The apparatus, systems, and methods of the present invention allow forthe formation of a robust coupling between a cover of a device, such asa handheld electronic device, and a housing of such a device. Handheldelectronic devices may generally include, but are not limited toincluding, mobile phones, media players, user input devices (e.g.,mouse, touch sensitive devices), personal digital assistants, remotecontrols, electronic book readers, etc. The apparatus, systems, andmethods may also be used for covers (e.g., covers with glass members),or displays for other relatively larger form factor electronic devicessuch as portable computers, tablet computers, displays, monitors,televisions, etc.

In general, a device that includes a cover which is securely held to ahousing is relatively durable or robust. A secure coupling between thecover and the housing may be arranged in an interior volume of a devicesuch that the coupling does not interfere with the exterior of thedevice. The aesthetic qualities of a device can be enhanced. In oneembodiment, a cover and a housing interface together with substantiallyno gap space therebetween. More generally, the aesthetic or visualqualities of a device may be substantially improved by controlling thesize of a gap between a cover and a housing when the cover and thehousing are assembled. In addition, when the size of a gap between acover and a housing may be substantially minimized, the profile of adevice formed from the cover and the housing may be relatively thin.

FIG. 15A is a diagrammatic perspective representation of a housing towhich a cover, e.g., a cover which includes a glass member held by aframe, is assembled in accordance with an embodiment of the presentinvention. An assembly 1502 includes a cover 1508 which is mounted orsubstantially secured to a housing 1512. In one embodiment, cover 1508is removably attached to housing 1512 such that although cover 1508 issecurely engaged to housing 1512 when a coupling is desired. However, insome embodiments, the cover 1508 is removably attached such that cover1508 can be subsequently disengaged.

FIG. 15B is a diagrammatic cross-sectional side-view representation of acover 1508 assembled to housing 1512. As shown, the size of cover 1508and the size of housing 1512 as compared to FIG. 15A, are exaggeratedfor purposes of illustration. Cover 1508 and housing 1512 are coupled atan interface 1530 such that a gap 1528 between cover 1508 and housing1512 may be controlled. In one embodiment, gap 1528 is essentiallyminimal, and surfaces of cover 1508 and housing 1512 may come intocontact at and near interface 1530. Interface 1530 may includemechanical coupling arrangements, as will be discussed below, that allowcover 1508 to be mounted to housing 1512. As shown, interface 1530 istypically located in or near an inner volume defined by housing 1512 andcover 1508.

With reference to FIG. 16, one method of assembling an electronic devicewill be described in accordance with one embodiment. A method 1601 ofassembling an electronic device begins at step 1605 in which a housing,e.g., an outer periphery member, is formed. In general, one or morecomponents may form the housing. For example, two or more components maybe joined or otherwise combined to form the housing. Forming the housingmay also include attaching or otherwise creating attachment features onthe housing that are configured to facilitate mounting a cover on thehousing.

In step 1609, a cover is formed. Forming a cover may include, but is notlimited to including, obtaining a frame, and attaching a glass member tothe frame. It should be appreciated that forming a cover may alsoinclude effectively attaching or otherwise creating attachment features,as for example using an injection molding process, to the cover that areconfigured to facilitate mounting the cover to the housing. Whenattachment features are attached to the cover using an insert moldingprocess, cover can be formed at least partially from a plastic material.

Once the housing and the cover are formed, internal structuralcomponents, e.g., an internal platform that can include electroniccomponents, can be substantially connected to the housing in step 1613.For example, an internal member may be inserted within the housing andconnected to several portions of the housing to define a structuralcomponent.

After the internal structural components are substantially connected tothe housing, components may be inserted in step 1617 into the housing.For example, components, such as electrical components may be insertedfrom both sides of the housing. The cover may then be mounted on thehousing in step 1621. Mounting the cover on the housing may include, butis not limited to including, engaging attachment features of the coverand the housing. The method of assembling an electronic device can becompleted once the cover is mounted on the housing.

In one embodiment, a cover may be mounted on a housing through the useof screws. Referring next to FIG. 17, an assembly that includes sidescrews arranged to couple a cover to a housing will be described inaccordance with one embodiment. FIG. 17 is a diagrammatic side-viewrepresentation of an interior surface of an assembly 1702. Assembly 1702includes a portion of a cover 1708 and a portion of a housing 1712. Tabs1732 are inserted in or otherwise attached to cover 1708. In oneembodiment, tabs 1732 are metal tabs that are insert molded into cover1708 and effectively protrude from cover 1708. Metal tabs may be formedfrom sheet metal of any suitable thickness, as for example a thicknessof approximately 0.5 mm. Typically, tabs 1732 include slots throughwhich screws 1736 may be inserted. In other words, tabs 1732 aregenerally slotted tabs. Housing 1712 includes screw receptacles (notshown), e.g., threaded screw holes, which are arranged to accommodatescrews 1736.

When screws 1736 are used to secure tabs 1732 and, thus, cover 1708 tohousing 1712, washers 1740 may be positioned between heads of screws1736 and tabs 1732. Tabs 1732 are secured to housing 1712 when screws1736 are screwed into screw receptacles (not shown) created in housing1712. Tabs 1732, as shown, are secured to a surface of housing 1712 thatis different from a surface of housing 1712 that essentially comes intocontact with cover 1708.

FIG. 18 is a diagrammatic cross-sectional representation of a couplingthat utilizes a side screw and a slotted tab in accordance with oneembodiment. A housing 1812 has an opening 1844 defined therein. In thedescribed embodiment, opening 1844 is a threaded screw hole that may beformed into a side of housing 1812. A screw 1836 which is used to securea slotted tab 1832, i.e., a slotted tab 1832 that is attached to orotherwise coupled to a cover (not shown), to housing 1812 passes througha washer 1840 and a slot in slotted tab 1832, and is screwed intohousing 1812. Washer 1840 is generally used to promote threadengagement, i.e., washer 1840 enables a longer threaded length of screw1836, and provides tolerances. It should be appreciated that washer 1840may be optional.

In lieu of using screws to robustly mount a cover to a housing, othertypes of couplings may be used to robustly mount a cover to a housing.Another coupling that may be used to mount a cover to a housing includesa lobster snap and an internal structure (e.g., midplate). FIG. 19 is adiagrammatic cross-sectional representation of an assembly that includesa lobster snap and a midplate that cooperate to couple a cover frame toa housing in accordance with one embodiment. An assembly 1902 includes aportion of a cover 1908 and a portion of a housing 1912. A lobster snap1948 is mounted in or otherwise attached to cover 1908. Lobster snap1948, which may be formed from a metal that is insert molded into cover1908, is arranged to be engaged by a midplate 1952 coupled to housing1912. In one embodiment, lobster snap 1948 is formed from a compliantmetal that is arranged to deflect from a “rest” position when beingpushed through an opening defined in midplate 1952, and to substantiallyreturn to the rest position once inserted through the opening. Thethickness of the metal used to form lobster snap 1948 may vary widely.In one embodiment, lobster snap 1948 may be formed from a sheet metalwith a thickness of approximately 0.3 mm.

Midplate 1952, which may be formed from metal, may be coupled to housing1912 using any suitable method. By way of example, midplate 1952 may bewelded into an interior surface of housing 1912. Referring next to FIG.20, a housing to which a midplate is coupled, e.g., by welding, can bedescribed in accordance with one embodiment. A housing 2012, which maybe formed from metal, has an exterior surface (not shown) and aninterior surface 2058. A midplate 2052, which may be a piece of sheetmetal with at least one cut-out 2056 defined at an edge, is welded tointerior surface 2058. When midplate 2052 is welded to interior surface2058, cut-out 2056 cooperates with interior surface 2058 to define anopening through which a lobster snap, e.g., lobster snap 1948 of FIG.19, may be inserted.

Another suitable coupling that allows a cover to be mounted on a housingis a snap arrangement that includes a bracket configured to accommodatea tab. Such a bracket may be mounted on a housing, and may include acomplaint snap which is arranged to engage a tab coupled to a cover.FIG. 21 is a diagrammatic representation of a cover piece having aninsert molded tab and a housing having a bracket configured toaccommodate the tab in accordance with one embodiment. An assembly 2102,which is shown in a disassembled form for ease of illustration, includesa portion of a cover 2108 and a portion of a housing 2112. Cover 2108includes a tab or a hook 2060 in which an opening is defined. Tab 2160,which may be formed from a sheet metal of any suitable thickness, e.g.,a thickness of approximately 0.5 mm, may be insert molded into cover2108. Housing 2112 has a bracket 2164 coupled thereto. Bracket 2164,which may be formed from a metal, may be welded to a surface, e.g., aninterior surface, of housing 2112.

A compliant snap 2168 is formed in bracket 2164, and is configured toengage with tab 2160 when tab 2160 is inserted through an opening 2172,e.g., a “doghouse” snap opening,” defined by bracket 2164 and aninterior surface of housing 2112. A compressive force is generallyapplied by compliant snap 2168 against tab 2160 to secure tab 2160within opening 2172 and, thus, to hold cover 2108 substantially againsthousing 2112.

FIG. 22 is a process flow diagram which illustrates a method of creatinga device that includes a cover piece having an insert molded tab and ahousing having a bracket configured to accommodate the tab, as forexample described above with respect to FIG. 21, in accordance with oneembodiment. A method 2201 of creating a device that includes a coverpiece which is mounted to a housing using a coupling that includes a taband a bracket begins at step 2205 in which brackets, i.e., bracketswhich include a snap component, can be welded around the perimeter ofthe sides of a housing. Brackets may, for example, be same or similar tobracket 2164 of FIG. 21. Any number of brackets may generally be weldedaround the perimeter of the sides of a housing. By way of example, tenbrackets may be welded around the perimeter of the housing. It should beappreciated that brackets may also be attached to the housing usingmethods other than welding.

Once brackets are welded or, more generally, attached to the perimeterof the sides of the housing, tabs or hooks can be insert molded to coversupport in step 2209. Then, in step 2213, a glass piece is coupled tothe cover support to form an overall cover part. In one embodiment, thecover support may be a frame within which the glass piece may besecured. Any suitable method may typically be used to couple the glasspiece to the cover piece.

After the overall cover part is formed, process flow moves to step 2217in which internal components are placed within an interior volumedefined within the housing. The internal components generally include,but are not limited to including, electronic components. The overallcover part is assembled against the housing in step 2221 such that thetabs in the cover piece are substantially inserted through doghouseopenings in the brackets welded to the housing. When tabs are insertedthrough doghouse openings, complaint snaps of the brackets may engagethe tabs to hold the overall cover part against the housing. Uponassembling the overall cover part against the housing such that tabs gothrough doghouse openings in brackets, the method of creating a deviceis completed.

Although only a few embodiments of the invention have been described, itshould be understood that the invention may be embodied in many otherspecific forms without departing from the spirit or the scope of thepresent invention. By way of example, a cover has generally beendescribed as being removably coupled to a housing. Screws may beunscrewed to remove a cover from a housing, snaps may be disengaged froma midplate, and tabs may be disengaged from a snap. The ability tosubstantially disengage or decouple a cover from a housing may enablemaintenance and repairs to be performed on components held by thehousing. In some embodiments, however, cover may be substantiallyirremovably coupled to a housing.

While a cover has generally been described as including a cover support(e.g., frame) to which a glass member is attached, it should beappreciated that the cover itself may be a glass member. In anembodiment in which the cover itself is a glass member, attachmentfeatures such as tabs and snaps may be glued directly to the glassmember or indirectly to the glass member. When attachment features areglued indirectly to the glass member, the attachment features may beinsert molded into pieces of plastic, and the pieces of plastic may beglued or otherwise attached to the glass member.

As shown for example in FIGS. 17 and 19, the side of a housing which isassociated with the engagement of a tab of a cover part is not the sameas the side of the housing which interfaces with, e.g., comessubstantially into contact with, the cover part. That is, the side of ahousing that is used to engage a cover is different from the side orsurface of the housing that is substantially sealed against the cover.It should be appreciated that in lieu of the housing substantially beingsealed against the cover when the housing engages the cover, there mayinstead be a gap between the housing and the cover. In one embodiment, amaterial such as a compliant material may be placed in the gap betweenthe housing and the cover.

Any number of coupling arrangements that allow a cover to be mounted toa housing may generally be included in an electronic device. Couplingarrangements are generally arranged along an interior periphery of anelectronic device, and the number of coupling arrangements in anelectronic device may be dependent upon factors including, but notlimited to including, the size of the electronic device and the spaceavailable in the interior of the electronic device. In one embodiment,between approximately ten and approximately twenty coupling arrangementsmay be included in an electronic device. It should be appreciated,however, that fewer than ten and more than twenty coupling arrangementsmay generally be included in an electronic device.

Optical Lens Formation

According to still another aspect, an optical lens can be formed from aformed optical adhesive. The optical lens can, for example, be used as alens for a camera flash of a portable electronic device. A mold can beused to form a lens from an optical adhesive that can be cured whilebeing molded. For example, the optical adhesive can be a liquid adhesivethat can be cured by ultraviolet (UV) radiation. In one embodiment, amold (e.g., steel mold) having a lens configuration can be applied tothe uncured optical adhesive, and then UV radiation applied to cure theoptical adhesive. Once cured, the mold can be removed and the opticallens has been formed. In one particular embodiment, the optical lens canbe formed on an inner surface of a glass housing member for a portableelectronic device, and the curing of the optical adhesive to form theoptical lens can be performed by UV radiation that is directed to theoptical adhesive through the glass housing member. In another particularembodiment, the optical lens can be formed on an optical substrate(e.g., clear plastic carrier), and then the optical substrate can laterbe mounted in a portable electronic device, such as on an inner surfaceof a glass housing member for the portable electronic device.

In one embodiment, the portable electronic device having the opticallens formed from the optical adhesive can be configured to include ahousing surface that has at least an opening or transparent portion. Theportable electronic device can also include a camera and a camera flashlight element for producing light. The optical lens receives at least aportion of light produced by the camera flash light element, and directsthe received light through the opening or transparent portion of thehousing surface. The optical lens can be formed from an optical adhesivethat is molded and cured into a predetermined lens configuration.

Cover Assembly Structure and Assembly

According to still another aspect, a cover assembly, such as a backcover assembly, can be configured to support and protect an outer glassmember. The cover assembly can form part of a housing for an electronicdevice. The cover assembly can also include a distinct glass lens,attachment members, and structural support.

FIGS. 23A-23C illustrate perspective diagrams of a back cover assembly2300 according to one embodiment. The back cover assembly 2300 can, forexample, represent one implementation of the back cover assembly 260illustrated in FIG. 2B. The back cover assembly 2300 can also representthe assembly of the second outer housing member 1016 and the secondinterface member 1018 (with the protective side members 1020)illustrated in FIG. 10, and/or the assembly of the second outer housingmember 1216 and the second interface member 1218 (with the protectiveside members 1220) illustrated in FIG. 12.

FIG. 23A illustrates a front perspective diagram for the back coverassembly 2300 according to one embodiment. The back cover assembly 2300can include an interface member 2302 and a glass member 2304 (e.g.,glass plate). The interface member 2302 provides a support structurethat can be secured to a base housing. In one embodiment, the interfacemember 2302 can be removably secured to the base housing.

The back cover assembly 2300 can be secured to the base housing in anyof a variety of ways. In the embodiment of the interface member 2302illustrated in FIG. 23A, the interface member 2302 includes one or moretabs 2306 and one or more hooks 2308. The one or more tabs 2306 and theone or more hooks 2308 are used to secure the back cover assembly 2300to the base housing, such as the outer periphery member 220 discussedabove. The one or more hooks 2306 can include threaded openings (e.g.,holes) that can receive attachment screws, which serve to firmly securethe back cover assembly 2300 to the base housing (e.g., the outerperiphery member 220). The attachment screws can prevent removal of theback cover assembly 2300 from the base housing. However, by removal ofthe attachment screws, the back cover assembly 2300 can then be removed.

The glass member 2304 is a thin glass sheet that is configured to fitwithin a recess provided by the interface member 2302. In oneembodiment, while within the recess, the sides (e.g., edges) of theglass member 2304 can be protected by protective side structuralmembers. A glass piece 2310 and an optical barrier 2312 can be coupledto the glass member 2304. The glass piece 2310 can be provided for animage acquisition device (e.g., camera) that is provided within the basehousing for the electronic device. The glass piece 2310 is separate fromthe glass member 2304. The glass piece 2310 can also provide differentoptical properties than those of the glass member 2304. For example, theglass piece 2310 may (itself or via a coating) provide optical filtering(e.g., infrared filtering) or magnification. In other words, the glasspiece 2310 can act as a lens, a filter or both.

The size, dimensions and materials for the components of the housing forthe electronic device can vary with different embodiments. In the caseof portable electronic devices, the thickness of the back cover assembly2300 (excluding the one or more tabs 2306 and the one or more hooks2308) can be about 5 millimeters or less. For thin, portable electronicdevices (such as handheld electronic devices), the thickness of the backcover assembly 2300 (excluding the one or more tabs 2306 and the one ormore hooks 2308) can be about 2 millimeters or less millimeters.Moreover, the thickness of the glass member 2304 can be about 1millimeter or less. For example, the thickness of the glass of the glassmember 2304 can be about 0.3 to 0.6 micrometers. The glass member 2304is glass (e.g., alumina silicate or soda lime glass). However, inalternative embodiments, the glass member 2304 could be replaced by amember that is made (in whole or in part) of metal, ceramic and/orplastic material.

FIG. 23B illustrates a rear perspective diagram for the back coverassembly 2300 according to one embodiment. The interface member 2302primarily extends around a periphery of the back cover assembly 2300.The interface member 2302 can be made from a polymer. The interfacemember 2302 illustrates a lens holder 2314 to secure the glass piece2310 to the interface member 2302. The interface member 2302 can alsoinclude a reinforcement plate 2316 that serves to strengthen theinterface member 2302. The reinforcement plate 2316 can be formed ofmetal, such as stainless steel. The reinforcement plate 2316 is aseparate piece from an outer periphery support portion 2318. Thereinforcement plate 2316 can be secured to the outer periphery supportportion 2318. For example, the reinforcement plate 2316 can be insertedinto the outer periphery support portion 2318 had held in place withslots and/or tabs. As another example, the outer periphery portion 2318can be insert molded around portions of the reinforcement plate 2316 tosecure the reinforcement plate 2316 to the outer periphery boundary2318. Additionally, in one embodiment, the one or more tabs 2306 and/orthe one or more hooks 2308 can be strengthened by features of thereinforcement plate 2316. For example, the one or more hooks 2308 can bestructurally reinforced by features of the reinforcement plate 2316 thatcan extend upward from the reinforcement plate 2316 into or adjacent theone or more hooks.

FIG. 23C illustrates an assembly diagram for the back cover assembly2300 according to one embodiment. The assembly of the back coverassembly 2300 can provide the interface member 2302 having the outerperiphery support portion 2318 secured or integral thereto. A layer ofadhesive 2320 can be provided between the reinforcement plate 2316 andthe interface member 2302. The layer of adhesive 2320 can be applied asa film, spray, tape or coating. Besides the layer of adhesive 2320,liquid adhesive can also be deposited in certain areas where the layerof adhesive 2320 is not present. The glass member 2304 can be pressedagainst the layer of adhesive 2320 (and liquid adhesive) so that theglass member 2304 can be attached to the interface member 2302.Specifically, the glass member 2304 once aligned and attached to theinterface member 2302 is not only secured thereto but also has its sides(edges) protected by the outer periphery support portion 2318. Byadhering the glass member 2304 to a substantial amount of its surfacearea, the glass member 2404 is reliably secured, such that in the eventof breakage of the glass member 2304, pieces of the glass member 2304will remain secured to the adhesive and this the back cover assembly2300.

Additionally, a back cover assembly can also include one or morefeatures to facilitate image acquisition. In one embodiment, the backcover assembly 2300 can also include an opening 2322 in the interfacemember 2302 for image acquisition components. Within the base housingthere can be provided an image acquisition device (generally, denoted asa camera), and the opening 2322 in the interface member 2300 can bealigned with the position of the image acquisition device. Additionally,the glass member 2304 can include an opening 2324 for receiving theglass piece 2310 as well as the lens holder 2314 that contains glasspiece 2310. An adhesive ring 2326 can be imposed between the lens holder2314 and the rear side of the glass member 2304 such that the adhesivering 2326 is disposed around the opening 2324 so as to secure the lensholder 2314 against the rear side of the glass member 2304.

FIG. 24 illustrates an assembly diagram for the glass member 2304according to one embodiment. Although the glass member 2304 is primarilya glass component form from a piece of glass 2400, other components ormaterials can be adhered to the piece of glass 2400 to make it bettersuited for its intended use as a back cover portion of housing for anelectronic device. Specifically, physical vapor deposition (PVD) ofmetal (e.g., aluminum) can provide marking on the piece of glass 2400.The marking can include graphic (e.g., logos) 2404 or text 2406. In thisembodiment, the marking can be provided on an inside surface of thepiece of glass 2400. The glass member 2304 can also include a maskinglayer 2408. The masking layer 2408 can also be provided on the insidesurface of the piece of glass 2400. The masking layer 2408 can color theotherwise translucent glass of the piece of glass 2400. The maskinglayer 2408 can render the glass member opaque so as to obscure or hidethe appearance of components behind the piece of glass 2400. Because themarking and the masking layer 2408 are on the inside surface of thepiece of glass 2400, they are protected by the piece of glass 2400 andthis unlikely to be damaged during use. Additionally, in one embodiment,a coating layer 2410 can be applied to an outer surface of the piece ofglass 2400. The coating layer 2410 can serve to reduce visibility offinger marks of a user from appearing on the outer surface of the pieceof glass 2400. The coating layer 2410 can provide an anti-fingerprintingcoating (e.g., Anti-fingerprint Fluorosilicate Coating) that can reducesurface contamination (smudging, staining) on the piece of glass 2400(e.g., anti-smudge coating).

Miscellaneous

In general, the steps associated with the methods of the presentinvention may vary widely. Steps may be added, removed, altered,combined, and reordered without departing from the spirit or the scopeof the present invention.

The various aspects, features, embodiments or implementations of theinvention described above may be used alone or in various combinations.For example, side screws and lobster snaps may cooperate to attach acover to a housing.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of the disclosure or of what maybe claimed, but rather as descriptions of features specific toparticular embodiment of the disclosure. Certain features that aredescribed in the context of separate embodiments may also be implementedin combination. Conversely, various features that are described in thecontext of a single embodiment may also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations, one or more features from a claimed combination can insome cases be excised from the combination, and the claimed combinationmay be directed to a subcombination or variation of a subcombination.

While embodiments and applications have been shown and described, itwould be apparent to those skilled in the art having the benefit of thisdisclosure that many more modifications than mentioned above arepossible without departing from the inventive concepts herein.

1. An electronic device enclosure, comprising: a front cover assemblyplaced and secured to provide a front surface for the electronic deviceenclosure, the front cover assembly including a front cover member and aprotective side member, the front cover member having exposed edges, andthe protective side member being provided against and around the exposededges of the front cover member.
 2. An electronic device enclosure asrecited in claim 1, wherein the front cover member comprises glass. 3.An electronic device enclosure as recited in claim 1, wherein theprotective side member comprises polyarylamide.
 4. An electronic deviceenclosure as recited in claim 1, wherein the protective side membercomprises is polymer strengthen with glass fibers.
 5. An electronicdevice enclosure as recited in claim 1, wherein the protective sidemember comprises a compound including at least polyarylamide and glassfibers.
 6. An electronic device enclosure as recited in claim 1, whereinthe protective side member comprises a polymer having a Coefficient ofThermal Expansion (CTE) less than or equal to about 50millimeters/meter/° C.
 7. An electronic device enclosure as recited inclaim 1, wherein the thickness of the protective side member is not morethan about 1 mm.
 8. An electronic device enclosure as recited in claim1, wherein the protective side member comprises a polymer having aCoefficient of Thermal Expansion (CTE) less than or equal to about 35millimeters/meter/° C.
 9. An electronic device enclosure as recited inclaim 1, wherein the front cover assembly further includes a supportmember and an attachment member, the support member supports the frontcover member, and the attachment member is integral with or attached tothe support member, the support member be integral with or attached tothe protective side member, the attachment member being use to securethe front cover assembly with respect to the electronic deviceenclosure.
 10. An electronic device enclosure as recited in claim 9,wherein the support member is a metal structure attached to orintegrally formed into the protective side member from of a polymer. 11.An electronic device enclosure as recited in claim 1, wherein thesupport member is molded into the protective side member.
 12. Anelectronic device enclosure as recited in claim 1, wherein the thicknessof the support member is about 0.2 mm.
 13. An electronic deviceenclosure as recited in claim 1, wherein the electronic device enclosurefurther includes a side member extending around a periphery of theelectronic device enclosure.
 14. An electronic device enclosure asrecited in claim 14, wherein the front cover assembly further includes asupport member and an attachment member, the support member supports thefront cover member, and the attachment member is integral with orattached to the support member, the support member be integral with orattached to the protective side member, the attachment member being useto secure the front cover assembly with respect to the side member. 15.An electronic device enclosure as recited in claim 14, wherein theelectronic device enclosure further comprises: a back cover assemblyplaced and secured to provide a back surface for the electronic deviceenclosure, the back cover assembly including a back cover member and aback protective side member, the back protective side member beingprovided against and around the sides of the back cover member, andwherein the back cover assembly further includes a back support memberand a back attachment member, the back support member supports the backcover member, and the back attachment member is integral with orattached to the back support member, the back support member be integralwith or attached to the back protective side member, the back attachmentmember being use to secure the back cover assembly with respect to theside member.
 16. An electronic device enclosure as recited in claim 1,wherein the electronic device enclosure further comprises: a back coverassembly placed and secured to provide a back surface for the electronicdevice enclosure, the back cover assembly including a back cover memberand a protective side member, the protective side member being providedagainst and around the sides of the back cover member.
 17. An electronicdevice enclosure as recited in claim 1, wherein the front cover membercomprises glass, and wherein the back cover member comprises glass. 18.An electronic device enclosure, comprising: a front cover assemblyplaced and secured to provide a front surface for the electronic deviceenclosure, the front cover assembly including a front cover member and afront interface member, the front cover member being adhered to thefront interface member; and a back cover assembly placed and secured toprovide a back surface for the electronic device enclosure, the backcover assembly including a back cover member and a back interfacemember, the back cover member being adhered to the back interface memberwith an adhesive layer.
 19. An electronic device enclosure as recited inclaim 18, wherein the front cover assembly comprises a front protectiveside member being provided against and around outer edges of the frontcover member, and wherein the back cover assembly comprises a backprotective side member being provided against and around outer edges ofthe back cover member.
 20. An electronic device enclosure as recited inclaim 18, wherein the back cover assembly further include a metal sheetprovided adjacent the interface member to provide structural supportthereto.
 21. An electronic device enclosure as recited in claim 18,wherein the back cover member comprises a glass sheet having a maskinglayer coating on a back side, and an anti-smudge coating on a frontside.
 22. An electronic device enclosure as recited in claim 18, whereinthe glass sheet includes an opening, and wherein a second glass piece isprovided within the opening in the glass sheet.
 23. An electronic deviceenclosure as recited in claim 18, wherein the back cover membercomprises an optical lens.
 24. An electronic device enclosure as recitedin claim 23, wherein the optical lens is formed from an optical adhesivethat is molded and cured into a predetermined lens configuration.
 25. Anelectronic device enclosure, comprising: an outer periphery memberdefining a side surface for the electronic device enclosure; an internalstructure secured to an inner surface of the outer periphery member, theinternal structure offset from front and back planar boundaries of theouter periphery member; and a front cover assembly placed and securedadjacent the front planar boundary of the outer peripheral boundary,thereby providing a front surface for the electronic device enclosure,wherein the front cover assembly includes a front cover member and aprotective side member, the protective side member being providedagainst and around the sides of the front cover member.
 26. Anelectronic device enclosed as recited in claim 25, wherein the frontcover member comprises glass.
 27. An electronic device enclosed asrecited in claim 25, wherein the protective side member comprisespolyarylamide.
 28. An electronic device enclosure as recited in claim25, wherein the thickness of the protective side member is not more thanabout 1 mm.
 29. An electronic device, comprising: a housing include atleast one a glass surface, the glass surface having a first glass piecewith first optical properties, and a second glass piece with secondoptical properties, the second optical properties being different thanthe first optical properties.
 30. An electronic device as recited inclaim 29, wherein the second glass piece is surrounded by the firstglass piece.